Intel has a slide show on Tom’s Hardware on how Processors are made. I found it to be well done but I have to wonder if this is some sort of advertisement for Intel.
The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.
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The first set of PPC vs Intel benchmarks have appeared. It was inevitable but it’s not a fair fight in this case, as the PPC machine has two processors vs the 1 P4. In addition the software is probably not well optimized for the Intel machine, thusly the PPC clearly kicked the ass of the Intel machine.
Lets see how well a current G4 based PowerBook does against a current Centrino based PowerBook. After all, there will never be a G5 PowerBook.
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